SD-528T low melt/low temperature solder removal paste

Sn42/Bi58, 100g syringe

This low melting temperature solder paste is a great low cost, easy to use alternative to removal alloy. A mixture of Sn42 and Bi58, it melts at 138°C and makes it extremely easy to remove large or fragile components like charge ports and FPC connectors without much heat. The solder paste form is very easy to apply and mix with leaded and lead free solder joints already on the board, especially compared to wire removal alloy. Stop pulling pads and melting connectors today! 

Refrigerate when not in use. Plunger and needle sold separately.

Watch a demo below!